Lewis University Research Findings to be Presented by Pall at International Conference

PORT WASHINGTON, N.Y. — (BUSINESS WIRE) — November 2, 2011 — Interactions between nanoparticles and filter media is the topic of a recent research study conducted by Lewis University (Romeoville, IL) in collaboration with Pall Corporation (NYSE: PLL). The findings of the study will be presented by Pall at the International Conference on Planarization/CMP Technology (ICPT), Nov. 9-11 in Seoul, Korea. The conference is an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on research in chemical mechanical planarization (CMP) technology.

In semiconductor manufacturing, the reduction of wafer defects can lead to improved process yields and lower overall processing costs. The findings from the Abrasive Nanoparticle/Filter Media Interactions study will be utilized to provide more tailored product solutions for CMP applications that can help ensure product quality and potentially reduce defects. Patrick Levy, CMP product manager for Pall, will present the findings. Lewis University Assistant Professor of Chemistry Dr. Jason Keleher and Alumnus Vince Schade performed the research, which was sponsored by a Pall Corporation grant.

“Pall’s decision to work with Lewis University was based on an evaluation of the knowledge, experience, and dedication of the Chemistry department in the fields of nanotechnology and CMP,” said Steve Chisolm, senior corporate vice president, Pall Microelectronics. “Collaboration with leading educators and researchers, such as Lewis University, is an important part of Pall’s technology development process and is critical to the continued advancement of filtration solutions for microelectronics.”

Added Keleher, “This project is a good example of how our students are learning to partner with industry on research that can lead to state-of-the-art commercial solutions.”

To learn more about Pall’s solutions for semiconductor manufacturers, please visit:

http://www.pall.com/main/Microelectronics/Chemical-Mechanical-Polishing-Filtration-54166.page

About Pall Corporation

Pall Corporation (NYSE: PLL) is a filtration, separation and purification leader providing solutions to meet the critical fluid management needs of customers across the broad spectrum of life sciences and industry. Pall works with customers to advance health, safety and environmentally responsible technologies. The Company’s engineered products enable process and product innovation and minimize emissions and waste. Pall Corporation, with total revenues of $2.7 billion for fiscal year 2011, is an S&P 500 company with almost 11,000 employees serving customers worldwide. Pall has been named a “top green company” by Newsweek magazine. To see how Pall is helping enable a greener, safer, more sustainable future, follow us on Twitter @PallCorporation or visit www.pall.com/green.

Lewis University (Romeoville, IL) is a Catholic university offering distinctive undergraduate and graduate programs to nearly 6,500 traditional and adult students. Lewis offers multiple campus locations, online degree programs, and a variety of formats that provide accessibility and convenience to a growing student population. Sponsored by the De La Salle Christian Brothers, Lewis prepares intellectually engaged, ethically grounded, globally aware, and socially responsible graduates. The ninth largest private not-for-profit university in Illinois, Lewis has been nationally recognized by The Princeton Review and U.S. News & World Report. Visit www.lewisu.edu for further information.

Editor’s Note: High-resolution photographs of Vincent Schade working in a Lewis University lab are available at:

http://www.lewisu.edu/photos/schade1-HR.jpg

http://www.lewisu.edu/photos/schade2-HR.jpg

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Contact:

Pall Corporation
Marie MacLean
Director, Pall Industrial Global Marketing Communications
Telephone: 516-801-9282
Mobile: 516-492-1462
Email: Email Contact
or
Lewis University
Kathrynne Skonicki
Director of Media Relations
Telephone: 815-536-5711
Email: Email Contact